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대학 인프라와 자원을 공유해 공동 연구와 기술 활용을 지원합니다.

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플라즈마 처리 시스템

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Plasma process system

  • 모델명 CUTE
  • 제조사 펨토사이언스(Femto Science)
  • 장비용도 기타
  • 장비구분 기계가공/시험장비 > 반도체장비 > 플라즈마기상화학증착장비

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구축일자 2022-04-20
납품업체 펨토사이언스(Femto Science)
위치 광주광역시 북구 첨단과기로 123 (오룡동) 광주과학기술원 전기전자컴퓨터공학동 F3층 310호
구성및성능 Specification
① Main System
1) Process Chamber
-Type : Rectangular, horizontal chamber with door
-Chamber inner
- Size : 140mm x 200mm x 110mm (W x D x H)
- Finishing : By precision lapping & ultrasonic cleaned
-Minimum leakage design
- Chamber is machined out of solid Aluminum block. (Welding free!)
- O-rings : Specially coated (Silica encapsulated) Viton
- Dovetail grooves for all seals
- Vent screws for inner chamber
-Uniform gas flow design
- Gas shower head integrated door
- Multi-perforated plate between plasma region and buffer
- Zone separation (Plasma Zone & Buffer Zone)

2) Generator
- Frequency : 20 ~ 100kHz with 10kHz increment
- Power : up to 100W with free adjustment
- Automatic impedance matching : By DSP on board feedback monitoring & control

3) Gas Line Package
- Process gas line
- Gas channel : 1 x gas line (User define the gas species, otherwise O2
)
- Additional gas line : 2 x empty gas line for future up-grade
- Gas flow control : By MFC (Mass Flow Controller)
- Stainless steel gas line with 1/4" Swagelok fittings as standard
- Purge (Flush) line
- 1 x purge line (purge gas can be defined by user - Nitrogen, CDA, Air, ..…)
- Stainless steel gas line with 1/4" Swagelok fittings as standard
- Vent line
- 1 x vent line (vent gas can be defined by user - Nitrogen, CDA, Air, ..…)
- Stainless steel gas line with 1/4" Swagelok fittings as standard
- Gas manifold block
- 5 x input / 1 x output gas manifold block
- 1/4" Swagelok fittings as standard
- Mass Flow Controller
- Flow rate : up to 100sccm (User define the flow rate, otherwise 100sccm)
- Flow rate control range : 2 to 100% of full scale
- Response speed : Less than 1sec
- Accuracy : ± 1% of full scale
- Linearity : ± 0.5% of full scale
- Operating temperature : 5 to 50℃
장비안내 저진공 하에서 O2, Ar, H2 등의 처리 기체에 전압을 가하여 플라즈마화 시켜 표면 활성화, 에칭 등의 기능을 할 수 있는 장치

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