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논문 리스트

2015
금속 전극을 포함한 미세유체 칩의 인서트 사출성형 충전 공정 해석 Numerical Analysis of the Filling Stage in Insert Injection Molding of Microfluidic Chip with Metal Electrodes
한국정밀공학회
이봉기 외 1명
논문정보
Publisher
한국정밀공학회지
Issue Date
2015-11-01
Keywords
-
Citation
-
Source
-
Journal Title
-
Volume
32
Number
11
Start Page
969
End Page
976
DOI
ISSN
12259071
Abstract
In the present study, a numerical investigation of an insert injection molding process was carried out for the development of thermoplastic microfluidic chip plates with metal electrodes. Insert injection molding technology enables efficient realization of a plastic-metal hybrid structure and various efforts have been undertaken to produce novel components in several application fields. The microfluidic chip with metal inserts was proposed as a representative example and its molding process was analyzed. The important characteristics of the filling stage, such as the effects of filling time and thickness of the part cavity, were characterized. Furthermore, the detailed distributions of pressure and temperature at the end of the filling stage were investigated, revealing the significance of metal insert temperature.

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